1. Reverse Engineering & Custom Hardware Creation
Sample-to-Production & Concept-to-Production| Capability / Service | Standard Specification & Deliverables | Advanced / Specialist Capability |
|---|---|---|
| PCB Layer Recovery & Cloning | 1 – 16 Layers Rigid, Flex, Aluminum MCPCB | Up to 32 Layers HDI & Rigid-Flex |
| Engineering File Deliverables | Gerber RS-274X / ODB++, Full BOM, Centroid (Pick & Place) | 100% Editable PCB & Schematic Files |
| Supported EDA / CAD Formats | Altium Designer, Protel, PADS, KiCad | Cadence Allegro, OrCAD, Eagle |
| BOM & Component Engineering | Full BOM Extraction, Precision LCR Passive Measurement | EOL / Obsolete Part Drop-in Replacement |
| IC / MCU Firmware Recovery | Standard MCU / EEPROM / Flash Memory Extraction | ARM, STM32, PIC, AVR, CPLD/FPGA, DSP |
| Custom Design & Optimization | Schematic-to-Layout, DFM / DFT Review, Cost-Down Redesign | High-Speed Signal Integrity & EMC/EMI Fix |
| Verification & Accuracy | 100% 1:1 Flying Probe Netlist & Continuity Check vs. Sample | First-Article Functional Clone Guarantee |
2. Bare PCB Fabrication Capabilities
Rigid, Flex, Rigid-Flex, High-Frequency & Metal Core| Parameter | Standard Production Capability | Advanced / Quick-Turn Limit |
|---|---|---|
| Layer Count | 1 – 16 Layers (Rigid) | 1 – 4 Layers (Flex) | Up to 32 Layers (Rigid) | 16L Rigid-Flex |
| Base Materials / Substrates | FR-4 (Tg 135°C / 150°C / 170°C), Aluminum MCPCB, Polyimide | Rogers, PTFE, Taconic, Isola, Copper Core |
| Board Thickness & Copper | 0.4 mm – 3.2 mm Thickness | 0.5 oz – 4.0 oz Finished Copper | 0.2 mm – 6.0 mm | Up to 10 oz Heavy Copper |
| Min. Trace Width / Spacing | 4 / 4 mil (0.10 / 0.10 mm) — 3 / 3 mil (0.075 / 0.075 mm) | 2.5 / 2.5 mil (0.063 / 0.063 mm) HDI |
| Min. Drill / Via Structure | 0.15 mm (6 mil) Mechanical Drill | Through-Hole & Tenting | 0.10 mm Laser Microvia, Blind/Buried, VIPPO |
| Surface Finishes | Lead-Free HASL, ENIG (Immersion Gold 1–3 u"), OSP | ENEPIG, Immersion Silver/Tin, Hard Gold (50u") |
| Impedance & Solder Mask | ±10% Controlled Impedance | Green, Black, Matte Black, White, Red, Blue | ±5% Precision Impedance | LPI & Peelable Mask |
3. Turnkey PCBA & SMT Assembly Capabilities
Full Turnkey Sourcing, High-Speed SMT, THT & Box-Build| Parameter | Standard Assembly Capability | Advanced / Fine-Pitch Capability |
|---|---|---|
| Assembly Process | Single & Double-Sided SMT, THT Wave Soldering, Mixed Tech | Nitrogen (N2) Reflow, Selective Wave, Press-Fit |
| Component Sourcing | Full Turnkey (DigiKey, Mouser, Arrow, LCSC), Consigned, Hybrid | Hard-to-Find & Cross-Reference Engineering |
| Min. Chip & IC Package | 0201, 0402, 0603 Passives | QFP, QFN, DFN, SOIC, BGA | 01005 Metric | 0.25 mm Pitch uBGA, CSP, PoP |
| Placement Accuracy & PCB Size | ±0.03 mm Laser Vision Alignment | Max Board: 510 × 460 mm | ±0.025 mm Ultra-Fine IC Placement | Flex Carriers |
| Post-Assembly & Value-Add | IC Flashing / Programming, Cable Harness, Conformal Coating | Full Enclosure Box-Build, Potting & Custom Packing |
4. Quality Control & Testing
Zero-Defect Assurance| Incoming IQC | 100% Visual, Marking, LCR Verification & X-Ray Reel Count |
| In-Line SMT Inspection | 3D SPI (Solder Paste), Pre/Post-Reflow 3D AOI, FAI Report |
| X-Ray Inspection | 100% Automated X-Ray (AXI) for BGA, uBGA, QFN Void Check |
| Electrical & Functional | Flying Probe, Custom ICT Jigs, Custom FCT & Burn-In Aging |
5. Typical Turnaround Time
Fast Global Delivery| Reverse Engineering | 1–2 Days (2–4L) | 3–7 Days (6–32L) |
| Bare PCB Fabrication | 24–72h (Prototype) | 5–10 Days (Batch) |
| BOM Component Sourcing | 2–5 Working Days (Global Authorized) |
| SMT / PCBA Assembly | 24–72h (Proto) | 3–7 Days (Mass Prod.) |